Keyword Factory
This tool helps you to expand your technical vocabulary using the arXiv dataset.
Note that terms which occur infrequently in arXiv articles will not return good (if any) results.
Read about our method here.
vias
is associated with:
through-substrate,   
through-silicon,   
tsv,   
planarized,   
emft,   
buttable,   
icvs,   
bump-bonding,   
slid,   
solder,   
n-in-p,   
backside,   
photolithography,   
silicon-on-insulator,   
etched,   
vertical-integration,   
inductors,   
stripline,   
wafer,   
interconnect,   
soi,   
interdiffusion,   
cmos
Using these keywords in combination
with vias will
help you expand your search horizons.